Website OpenAI
About the Team
OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.
Role Overview
We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions. You will work closely with chip design, package design, and system engineering teams to develop simulation methodologies, validate models against hardware measurements, and guide design decisions to meet performance, reliability, and manufacturability targets.
Key Responsibilities
- Develop and execute multi-physics simulation workflows covering thermal, thermo-mechanical stress, electrical, and signal/power integrity for advanced packaging architectures including 2.5D/3D-IC and chiplet-based designs
- Build and validate predictive models for warpage, thermal resistance, solder joint reliability, and electrical parasitics across the package stack
- Partner with chip, package, and system design teams to define simulation requirements and translate results into actionable design guidelines
- Drive design of experiments (DoE) and sensitivity analyses to identify key variables impacting performance and yield
- Develop automation frameworks and scripting tools to scale simulation throughput and improve model accuracy
- Collaborate with external partners including OSAT, substrate suppliers, and EDA vendors to advance simulation capabilities and validate methodologies
- Contribute to the development of internal simulation infrastructure and best practices for multi-physics co-simulation
Minimum Qualifications
- BS/MS/PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field
- 5+ years of industry experience in advanced packaging simulation, with hands-on expertise in multi-physics co-simulation across thermal, mechanical, and electrical domains
- Demonstrated ability to solve complex engineering challenges using multi-physics simulation and first-principles engineering approaches
- Hands-on experience with FEA and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent
- Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration, and thermo-mechanical interactions
Preferred Qualifications
- Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications
- Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking
- Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes
- Experience with scripting and automation (Python, APDL, or similar) to streamline simulation workflows
Compensation: $266,000 – $445,000 + equity.
To apply for this job please visit jobs.ashbyhq.com.
